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Plasma / Oxide Etch Wafer Holder Rings |
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Features
CoorsTek wafer clamping rings withstand the highly corrosive conditions during reactive ion etching. Our material maintains its strength, resilience, and dimensional stability with exposure to etchant gases up to 260" C in vacuums and high-plasma wattage.
The CoorsTek wafer-clamping rings differ from more commonly used materials by the processing methods. Most importantly, our wafer clamp rings are manufactured using advanced clean-molding technologies enabling significant prices reductions over competitive technology.
CoorsTek Plasma Etch Clamp Rings are typically 50% less than competitive rings.
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